DARPA’s CHIPS (Common Heterogeneous Integration and IP Reuse Strategies) program outlines a vision for modular chiplet-based design aimed at accelerating innovation in microelectronics. The initiative emphasizes the use of reusable IP blocks, standardized interfaces, and flexible integration across diverse technologies and process nodes.
CHIPS seeks to overcome traditional design bottlenecks, lower development costs, and enable rapid prototyping and deployment for both defense and commercial systems. Core goals include fostering an open ecosystem, promoting heterogeneous integration, and supporting secure, high-performance computing architectures.
